HASL Lead-Free
HASLHot air solder levelling with lead-free solder. Cost-effective, good solderability and rework friendly, but the surface is not perfectly flat for fine-pitch parts.
Shelf life: 12 months
Capabilities
Verifiable capabilities, documented in numbers
Everything below reflects standard production capability. Where your design needs tighter limits, our engineers confirm feasibility during DFM review before the order is released.
PCB Fabrication
The parameters engineers ask about first. Values below are standard production capability; tighter limits are confirmed case by case during DFM review.
Confirm your design| Layer count | 1 - 40 layers (IC substrate up to 64) |
|---|---|
| Board thickness | 0.2 - 6.0 mm |
| Min trace / space | 4 / 4 mil standard, 3 / 3 mil advanced, 2 / 2 mil fine-line |
| Min mechanical hole | 0.2 mm |
| Min laser hole | 0.1 mm |
| Copper weight | 0.5 oz - 12 oz |
| Max board size | 600 × 570 mm (up to 1250 × 570 mm) |
| Min board size | 5 × 5 mm |
| Board thickness tolerance | ±10% (IPC-6012 class 2) |
| Impedance tolerance | ±10% standard, ±7% on qualified stack-up |
| Solder mask | Green, red, blue, black, white, yellow, matte |
| Silkscreen | White, black, yellow; min character 5 mil |
Flex & Rigid-Flex
Polyimide based constructions, including dynamic flex designs that bend repeatedly in service.
Confirm your design| Flex layer count | 1 - 8 layers |
|---|---|
| Rigid-flex layer count | 2 - 12 layers |
| Flex sections | 1 - 6 per board |
| Flex thickness | 0.05 - 0.45 mm |
| Copper type | Rolled annealed or electrodeposited, 1/3 oz - 2 oz |
| Coverlay | Polyimide 12.5 - 50 µm |
| Stiffener | FR-4, polyimide, aluminium, steel |
| Min bend radius (static) | 3 × board thickness |
| Min bend radius (dynamic) | 10 × board thickness |
Testing & Inspection
Verification points from incoming material to final shipment, recorded per production lot.
Confirm your design| Inner-layer inspection | AOI on every inner layer before lamination |
|---|---|
| Outer-layer inspection | AOI plus visual check after etching |
| Electrical test | Flying probe or fixture test on all boards |
| Impedance test | TDR coupon measurement on controlled impedance orders |
| Cross-section | Micro-section on first article and per lot |
| Thermal stress | Solder float at 288°C for 10 seconds, 3 cycles |
| Solderability | MIL-STD-883 method on plated finishes |
| Final QC | Dimensional, cosmetic and workmanship check to IPC-A-600 class 2 |
Surface finish options
The finish protects exposed copper and determines solderability, shelf life and suitability for fine-pitch assembly. Choose by assembly method and storage window rather than by cost alone.
ENIG
ENIGElectroless nickel immersion gold. Flat surface suitable for fine-pitch BGA, wire bonding friendly and stable in storage. The default choice for HDI and high-density assemblies.
Shelf life: 12 months
OSP
OSPOrganic solderability preservative on bare copper. Flat and inexpensive, best for boards assembled shortly after delivery and single reflow cycles.
Shelf life: 6 months
Immersion Silver
ImmAgThin flat silver layer with excellent solderability and signal performance, commonly used on RF and high-speed digital boards.
Shelf life: 6 months
Immersion Tin
ImmSnFlat tin deposit suited to press-fit connectors and fine-pitch assembly. Requires careful handling and shorter storage windows.
Shelf life: 6 months
Hard Gold
Hard AuElectroplated nickel-gold on edge connectors and contact fingers, selected for repeated mating cycles and wear resistance.
Shelf life: 24 months
Materials library
Laminate selection drives thermal behaviour, signal loss and cost. We stock and process the materials below, and can source others against your specification.
| Material | Type | Typical application |
|---|---|---|
| Standard FR-4 | Epoxy glass, Tg 130 - 140°C | General purpose multilayer, consumer and industrial boards |
| High-Tg FR-4 | Epoxy glass, Tg 170 - 180°C | Lead-free assembly, automotive and high-temperature environments |
| Mid-loss / High-speed | Isola 370HR, FR408HR, Megtron 6 / 7 / 8 equivalents | Servers, backplanes and high-speed digital links |
| Rogers | RO3000, RO4000 series hydrocarbon ceramic | RF, microwave, antenna and radar modules |
| Taconic / Arlon | PTFE based laminates | Low-loss microwave and satellite circuits |
| Polyimide | Flex core, 12.5 - 50 µm | Flex and rigid-flex circuits with dynamic bending |
| Aluminium base | Metal core with thermally conductive dielectric | High-power LED lighting and power modules |
| Ceramic | Alumina, aluminium nitride | High-power density modules and thermal-critical devices |
Manufacturing tolerance
Standard tolerance applies to routine production; advanced tolerance is available on qualified designs and confirmed during engineering review.
| Item | Standard | Advanced |
|---|---|---|
| Board outline | ±0.20 mm | ±0.10 mm |
| Hole position | ±0.075 mm | ±0.05 mm |
| Hole size (plated) | ±0.075 mm | ±0.05 mm |
| Trace width | +20% / -15% | +15% / -10% |
| Board thickness | ±10% | ±8% |
| Impedance | ±10% | ±7% |
| Copper thickness | ±10% | ±8% |
Stack-up reference
Common starting points. Send your target impedance and layer count and we return a proposed stack-up with a TDR coupon definition.
| 2-layer | 1.6 mm FR-4, 1oz outer copper, signal / ground |
|---|---|
| 4-layer | 1.6 mm, signal - ground - power - signal, 0.2 mm prepreg |
| 6-layer | 1.6 mm, S-G-S-S-P-S with 1080 and 7628 prepreg |
| 8-layer | 2.0 mm, two ground reference planes adjacent to critical signal layers |
| Custom | Send your target impedance and layer count; we return a proposed stack-up with TDR coupon |
Have a design that pushes these limits?
Send the stack-up, outline drawing or Gerber data. Our engineers reply with a feasibility note and a quote, not a generic price list.