PCB fabrication and assembly under one roof
Our core business is PCB manufacturing. On top of that we run the whole assembly chain, so your boards never leave the site to be populated, tested and shipped back.
From product development to a packed, tested unit in six stages
Each stage has a named owner and a verification point, so a defect is caught where it happens instead of being argued about afterwards.
- Stage 01
Electronics Product Development
Hardware · Firmware · Enclosure design
Schematic capture, PCB layout, firmware bring-up support and enclosure design. DFM rules are applied while routing rather than after the design is released.
- Stage 02
PCB Manufacturing
Rigid · Flex · HDI · Metal core
Bare boards are made in our Mianyang plant, from quick-turn prototypes to volume multilayer, HDI, rigid-flex and special material construction.
- Stage 03
Components Procurement
Capacitors · ICs · Isolators · Sensors
The BOM is priced and sourced through authorised channels. Long lead-time, obsolete or allocation-constrained parts are reported before the build is released.
- Stage 04
Turnkey PCB Assembly
SMT · DIP · Reflow soldering
Paste printing, placement, reflow and through-hole soldering run on the same site as fabrication, so boards never leave to be populated and shipped back.
- Stage 05
Box Building
Housing · Battery · Display · Cable
Plastic or metal enclosure assembly, battery and display fitting, cable and harness installation, then finished-goods packing as one shippable lot.
- Stage 06
Quality Control
SPI · AOI · FAI · BGA rework
Paste, placement and solder-joint inspection plus first-article and functional verification, with a BGA rework station for joint recovery.
Three ways to split the material responsibility
Tell us how much of the BOM you want to control. The assembly process and the test standard stay the same in all three modes.
Turnkey
We supply the board, the components, the assembly and the test. One quote, one owner, one delivery date.
- PCB fabrication to your Gerber or ODB++
- Full BOM sourcing from authorised channels
- SMT, through-hole and press-fit assembly
- SPI, AOI, X-ray plus ICT or functional test
- Conformal coating, box-build and packing
Best for: Teams that want a single supplier and a single point of accountability for the finished assembly.
Quote this modePartial Turnkey
We source the common parts, you supply the critical or contracted components. Both sides are reconciled on one BOM.
- PCB fabrication and standard component sourcing
- Your supplied parts received, counted and stored per lot
- Shortfall and alternate reporting before release
- Assembly and test on the combined material set
Best for: Buyers with framework agreements on connectors, FPGAs or other parts they need to control directly.
Quote this modeConsigned Assembly
You supply the bare boards and all components. We provide the assembly labour, process control and test.
- Incoming inspection of your boards and material
- Stencil design and paste process control
- SMT, through-hole and press-fit assembly
- AOI, X-ray and functional test to your procedure
- Unused material returned and counted with the shipment
Best for: EMS and OEM teams that already hold the material and need a controlled assembly partner.
Quote this modeWhat the assembly line actually runs
These are the published limits for populated boards. Anything outside them is raised during DFM review before the order is accepted, not after.
| Minimum chip package | 0201 (0603 metric) |
|---|---|
| Fine-pitch devices | BGA, QFN and CSP, with X-ray inspection on BGA joints |
| Soldering processes | Reflow for SMT; selective and wave soldering for through-hole |
| Press-fit and hand solder | Supported, marked on the assembly drawing |
| SMT stencil | Laser-cut stainless steel, 0.10 - 0.15 mm typical |
| Panelisation | V-score, stamp hole or routed panel per your assembly drawing |
| Coating and potting | Conformal coating, potting and box-build on request |
| Traceability | Serialised assembly records linked to the fabrication lot |
| Assembly lead time | 5 - 12 working days after material readiness |
| Board size and thickness | Matches the fabrication range, see the capability table |
Six verification points between paste and packing
Which of these apply depends on your design and test specification. Tell us what you need covered and we confirm the plan with the quote.
Solder Paste Inspection
Paste volume, area and height are measured after printing, before any component is placed.
Automated Optical Inspection
Placement and solder joints are optically checked after placement and again after reflow.
X-ray Inspection
Used on BGA, QFN and other hidden joints where an optical check cannot see the interface.
In-Circuit Test
Fixture-based test for opens, shorts, component value and polarity on designs with test points.
Functional Test
The board is powered and exercised against your test procedure, with results recorded per serial number.
Burn-in and Aging
Extended powered operation to surface early failures, arranged on request for programme builds.
Send these with your first enquiry
A complete data package is what lets us quote a turnkey build accurately instead of coming back with assumptions.
Gerber or ODB++Required
Board data for fabrication, plus the paste layer for the stencil.
Bill of MaterialsRequired
Manufacturer part numbers, reference designators and quantities. An approved vendor list helps if you maintain one.
Pick-and-place / centroid fileRequired
X and Y coordinates plus rotation for every placed component.
Assembly drawingIf applicable
Notes press-fit parts, hand-solder items, orientation marks and panelisation requirements.
Test specificationIf applicable
Required for ICT or functional test: test points, procedure, pass criteria and any fixture you already own.
Each service on its own, or combined into one order
Assembly is the usual starting point, but every item below can also be ordered separately against boards made elsewhere.
PCB Assembly (PCBA)
Assembly as an optional value-added service on top of PCB fabrication. We run SMT placement, reflow, selective and wave soldering for through-hole parts, then AOI and functional test before packing. Keeping fabrication and assembly with one supplier removes the hand-off where most quality issues appear.
5 - 12 working days after material readiness
What we deliver
- SMT placement for 0201 up to fine-pitch BGA and QFN
- Through-hole and press-fit insertion with selective or wave soldering
- AOI after placement and reflow, plus X-ray on BGA when required
- Conformal coating, potting and box-build on request
- Serialised assembly records linked to the fabrication lot
Files we need
- BOM with manufacturer part numbers and reference designators
- Pick-and-place / centroid file (XY coordinates and rotation)
- Assembly drawing noting press-fit and hand-solder parts
- Gerber or ODB++ for stencil and board fabrication
SMT Stencil
Stencils are laser-cut from stainless steel foil, electropolished and inspected for aperture accuracy. Aperture reduction is applied where your design needs it, and we flag apertures that are likely to cause solder bridging or insufficient paste before the stencil is cut.
2 - 4 working days
What we deliver
- Laser-cut stainless steel foil, 0.10 - 0.15 mm typical
- Electropolished apertures for reliable paste release
- Aperture reduction recommendations from DFM review
- Framed or frameless format to match your printer
Files we need
- Gerber paste layer or ODB++ paste data
- Stencil size and printer model
- Foil thickness preference if you have one
Component Procurement
We source components through authorised distributors and franchised channels, and report any long lead-time, obsolete or allocation-constrained parts before the build is released. Where a part is unavailable, we propose a qualified alternate with the electrical and mechanical differences spelled out for your approval.
Depends on component lead time, quoted with the BOM
What we deliver
- Sourcing from authorised distributors and franchised channels
- Lead-time and lifecycle report before production release
- Qualified alternate proposals with difference notes
- Moisture-sensitive device handling and baking records
- Component traceability linked to the assembly lot
Files we need
- BOM with manufacturer part numbers and quantities
- Approved vendor list if your company maintains one
- Target build quantity and delivery date
PCB Layout
Layout support for teams without an in-house PCB designer, or for designs that need a manufacturability pass before release. Because the same engineers who review production orders do the layout, DFM rules are applied while routing rather than after it.
Quoted per design complexity
What we deliver
- Schematic capture and library creation
- Placement and routing to your electrical constraints
- Impedance-controlled stack-up design with TDR targets
- Gerber, ODB++, drill and assembly output package
- DFM report before release to fabrication
Files we need
- Schematic source or PDF with netlist
- Mechanical outline and connector positions
- Electrical constraints: impedance, current, clearance rules
Box Build & Enclosure Assembly
Box build turns a tested assembly into a shippable product. We fit the board into your plastic or metal housing, install batteries, displays, keypads and cable harnesses, apply labels and serial numbers, then pack to your specification. Because assembly and box build happen on the same site, a functional problem is found before the unit is closed rather than after.
Quoted together with the assembly order
What we deliver
- Plastic and metal housing assembly with torque control
- Battery, display, keypad and connector fitting
- Cable and wire harness installation with strain relief
- Serialisation, labelling and barcode marking
- Retail or bulk packing to your specification
Files we need
- Enclosure drawings or supplied housings
- Assembly instruction or exploded view
- Label artwork and serialisation rule
- Packing specification and carton markings
Combine fabrication and assembly in one order
Send your Gerber, BOM and pick-and-place file. We return a single quote covering boards, components, assembly and test.