ISO 9001
Quality management system covering PCB fabrication and assembly
Holder: Aisler group manufacturing sites
Quality Assurance
Traceable quality, verified at every stage
Quality here is a sequence of recorded checkpoints rather than a final inspection. Each lot carries its material batch, process parameters and test results.
Quality Control Flow
From incoming material to outgoing inspection
Five control stages run on every order, regardless of quantity or board complexity.
01
Incoming Material Control
Laminate, prepreg and chemicals are verified against supplier certificates, with lot numbers recorded before release to the line.
02
In-process Inspection
First-article checks at drilling, etching, lamination and plating, with AOI on every inner and outer layer.
03
Electrical Verification
Flying probe or fixture testing on all boards, checking opens, shorts and netlist against your source data.
04
Impedance & Reliability
TDR coupon measurement on controlled impedance orders, plus thermal stress, solder float and micro-section checks per lot.
05
Outgoing QC & Traceability
Final workmanship inspection to IPC-A-600, with lot records retained so any board can be traced back to its material batch.
Certifications
Systems and product certifications
Certificate holder and registered scope are stated for each entry, because scope determines which of your orders are actually covered.
ISO 14001
Environmental management system for production sites
Holder: Aisler group manufacturing sites
IATF 16949
Automotive quality management for automotive PCB orders
Holder: Aisler group manufacturing sites
ISO 13485
Medical device quality management for medical PCB production
Holder: Mianyang production base
UL
UL certified PCB constructions, flammability and electrical safety
Holder: Aisler group manufacturing sites
RoHS / REACH
Hazardous substance and chemical regulation compliance
Holder: All product lines
ISO 13485 medical device quality management is held by the Mianyang production base, which produces medical orders under that certified system. Certificate copies and registered scopes are available on request for qualification audits.
Reliability Testing
Tests run on production lots
Verification methods follow IPC and MIL references where applicable, and results are recorded on the lot traveller.
| Test | Method |
|---|---|
| Thermal stress | Solder float 288°C, 10 s, 3 cycles |
| Micro-section | Hole wall and plating thickness cross-section |
| Impedance | TDR measurement on coupon, target ±10% / ±7% |
| Peel strength | Copper to laminate adhesion after thermal excursion |
| Solderability | Wetting balance on plated finishes |
| Insulation resistance | Surface and volume resistance after humidity exposure |
Inspection Points
Testing and inspection capability
Where verification happens on the line, and what each point is able to catch.
Inner-layer inspection
AOI on every inner layer before lamination
Outer-layer inspection
AOI plus visual check after etching
Electrical test
Flying probe or fixture test on all boards
Impedance test
TDR coupon measurement on controlled impedance orders
Cross-section
Micro-section on first article and per lot
Thermal stress
Solder float at 288°C for 10 seconds, 3 cycles
Solderability
MIL-STD-883 method on plated finishes
Final QC
Dimensional, cosmetic and workmanship check to IPC-A-600 class 2
Workmanship standard
Boards are inspected to IPC-A-600 class 2 as standard, with class 3 available for medical, automotive and aerospace programmes. Acceptance criteria are agreed before production release so both sides inspect against the same document.
Need documentation for a qualification audit?
Tell us which records your quality team requires and we will confirm what travels with the shipment before you place the order.